Claims for Patent: 9,840,492

Summary for Patent: 9,840,492

Title:	Antifungal compounds and processes for making
Abstract:	The present invention relates to polymorphic forms of compound 1 or 1a and processes for preparing compound 1 and 1a polymorphs, which are useful as antifungal agents. In particular, the invention seeks to provide a new methodology for preparing polymorphs of compound 1 and substituted derivatives thereof.
Inventor(s):	Hoekstra; William J. (Durham, NC), Wirth; David Dale (Oak Ridge, NC), Ehiwe; Tracy (Cambridge, GB), Bonnaud; Thierry (Cambridge, GB)
Assignee:	Viamet Pharmaceuticals, Inc. (Durham, NC)
Application Number:	15/317,006
Patent Claims:	1. A polymorph of a compound of formula 1, ##STR00003## characterized by at least one of: (i) a powdered X-ray diffraction pattern having two or more peaks expressed in degrees 2-theta.+-.0.2.degree. and selected from peaks delineated in the pattern of FIG. 1; or (ii) a DSC thermogram showing an endotherm at about 101-108.degree. C. 2. The polymorph compound of claim 1, characterized by a powdered X-ray diffraction pattern having peaks expressed in degrees 2-theta.+-.0.2.degree. at each of about 8.4, 11.2, 17.8, 19.1, and 22.3. 3. The polymorph compound of claim 1, characterized by a melting point of about 101-108.degree. C. 4. The polymorph compound of claim 1, having less than 0.5% water therein. 5. The polymorph compound of claim 1, wherein the compound is essentially solvent free. 6. The polymorph compound of claim 1, wherein the compound has less than 0.5 wt. % solvent, less than 0.25 wt. % solvent, or less than 0.10 wt. % solvent.